ECS G321 DRIVER

Latest Articles , Enter your email address below to be notified when this product is no longer on back order. Enter your email address below and instructions to reset your password will be emailed to you. The silica slurry shows moderately high removal rates, good uniformity values, low defectivity, and excellent ability to remove the Ta liner. Services Email this article to a colleague Alert me when this article is cited Alert me if a correction is posted Article Usage Statistics Similar articles in this journal Similar articles in Web of Science Add to My File Cabinet Download to citation manager Purchase a print copy of this issue Permission requests.

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Add to Wish List. Because of the effective removal of the liner material, long overpolishing times become unnecessary, thus, spacer erosion is avoided.

Does this fit my vehicle? The product warranty is non-transferable. Esc Street-Line is an affordable coilover kit. For additional information see the terms of use. Corrosion induced defects are prevented by the v321 of a passivating agent. The study is performed on full mm wafers coated with blanket Cu films to examine removal rates and uniformity and on partial wafers to investigate the CMP of Cu damascene structures.

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Development of a Slurry Employing a Unique Silica Abrasive for the CMP of Cu Damascene Structures

Email Password Password must be at least 8 characters. Abstract We describe the development and examine the performance of a slurry containing an organic acid salt, a silica abrasive obtained from the hydrolysis of ethyl silicate TEOSand a passivating agent for the chemical mechanical planarization CMP of Cu damascene structures.

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To serve you better, please fill out the following g312. We describe the development and examine the performance of a slurry containing an organic acid salt, a silica abrasive obtained from the hydrolysis of ethyl silicate TEOSand a passivating agent for the chemical mechanical planarization CMP of Cu damascene structures.

Development of a Slurry Employing a Unique Silica Abrasive for the CMP of Cu Damascene Structures

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